S1150G
特点
● 不含卤素、锑、红磷等成分。废弃燃烧时不产生剧毒其他和残留有毒成分
● 优良的机械加工性和耐热性，与无铅制程兼容
● 耐CAF
应用领域
● 智能手机、平板电脑、笔记本电脑
● LED, 游戏机
● 汽车电子
● 通讯设备
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 155 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 355 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
| After Tg | ppm/℃ | 230 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 1.15E+08 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 9.61E+06 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 178 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | -- | 4.5 | |
| Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | -- | 0.011 | |
| Peel Strength (1 oz) | IPC-TM-650 2.4.8 | 288℃,10s | N/mm[lb/in] | 1.5[8.57] | |
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 630 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 480 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.1 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| CTI | IEC 60112 | A | Grade | PLC 1* | |
Remarks:
1. Specification sheet: IPC-4101/128, is for your reference only.
2. All the typical value is based on the 1.6mm (8*7628) specimen.
3. * Thickness≥1.4mm with 7628can meet PLC 1. If you need to use a CCL of thickness <1.4mm or PP thinnerthan 7628 for application of high CTI requirements, please consult Shengyicustomer service engineer in advance.
4. All the typical valuelisted above is for your reference only, please turn to Shengyi Technology Co.,Ltd for detailed information, and all rights from this data sheet are reservedby Shengyi Technology Co., Ltd.