SP168GN
特点
● 优异的机械加工性，适合压合工艺。
● 极小流胶，可挠曲加工极少碎屑。
● 高Tg无卤。
应用领域
适合用作散热板、多层板及软硬结合板粘结层- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 165 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 70 | |
|
After Tg |
ppm/℃ | 300 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- | >600S | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.85 | |
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.013 | |
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Copper (1 oz) | N/mm | 1.5 | |||
| CVL | N/mm | 1.0 | |||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105_d-2/23 | % | 0.14 | |
| Flammability | UL94 |
E-24/125 |
Rating | V-0 | |
Remarks:
1.Specimenthickness: 0.8mm. All the typical value listed above is for your referenceonly, please turn to Shengyi TechnologyCo., Ltd. for detailed information.
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.