S7045G
特点
● 高Tg＞170℃ (DSC)，无卤材料● 低插损，Dk/Df @1GHz: 4.30/0.010
● 更低的Z轴热膨胀系数，优异的通孔加工性
● 优异的耐CAF性能
● 使用RTF铜箔能获得更低的信号损耗
应用领域
● 服务器、交换机、路由器、基站、背板和线卡- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 175 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
190 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 390 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.30 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 4.15 | ||
|
IEC 61189-2-721 |
10GHz | -- | 4.50 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0100 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 0.0130 | ||
|
IEC 61189-2-721 |
10GHz | -- | 0.0130 | ||
| Peel Strength (1oz RTF copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.0 | |||
| 125℃ | N/mm | — | |||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.