SP225GN
特点
- 优良的机械加工能力，可用于冲孔。
- 提高刚挠结合板的耐翘曲性能。
应用领域
适用于散热板、模腔板和多层刚挠结合板的粘结材料。- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25 | TMA | ℃ |
190 |
| 2.4.24.2 | DMA | 225 | ||
|
Peel Strength |
2.4.8 |
Copper Foil（1/3oz） |
N/mm |
0.7 |
|
2.4.8 |
Copper Foil（1/2oz） |
N/mm |
1.0 | |
| 2.4.9 | CVL |
N/mm |
1.0 | |
|
T300 |
2.4.24.1 | TMA | min | ＞30 |
| Td | 2.4.24.6 | TGA(5% wt. loss) | ℃ | 410 |
|
Thermal Stress |
- |
288℃, solder dip |
s |
>600 |
|
Water Absorption |
2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
| CTE (Z-axis) | 2.4.24 |
TMA (before Tg) |
ppm/℃ | 34 |
| TMA (After Tg) | ppm/℃ | 115 | ||
|
|
|
|
||
| Dielectric Constant (RC67%@1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.21 |
|
Dissipation Factor(RC67%@1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.015 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: Specimen thickness: 0.8mm. Alltypical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information.
Explanations: C=Humidity conditioning;D=Immersion conditioning in distilled water; E=temperature conditioning.
All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailedinformation, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.